Huawei Ascend 950DT
The Huawei Ascend 950DT is the decode-and-training version of Huawei’s Ascend 950 die.
- Vendor
- Huawei
- Architecture
- Ascend 950 (SIMD + SIMT)
- Memory
- 144 GB HiZQ 2.0 (Huawei HBM)
- Memory bandwidth (TB/s)
- 4 TB/s
- FP8 (TFLOPS)
- 1,000 TFLOPS
- FP4 (PFLOPS)
- 2 PFLOPS
- Form factor
- NPU in Atlas 950 SuperPoD
- Status
- Announced
The Ascend 950DT is packaged with Huawei’s own HiZQ 2.0 HBM (144 GB, 4 TB/s) and 2 TB/s of interconnect bandwidth. Huawei gave its roadmap specs at Huawei Connect 2025, with availability in Q4 2026; it powers the Atlas 950 SuperPoD of up to 8,192 chips. At Huawei Connect 2026 Huawei said the Atlas 950 SuperPoD is in large-scale commercial use.
- Memory (GB)
- 144 GB
- Precision note (sparse or dense)
- Huawei states 1 PFLOPS in FP8, MXFP8 and HiF8 and 2 PFLOPS in MXFP4 for the Ascend 950 series, with no sparse/dense label.
- Launch
- Specs announced September 18, 2025; availability Q4 2026 per Huawei
- Vendor source
- huawei.com
- Checked
Questions
How much memory does the Huawei Ascend 950DT have?
The Ascend 950DT has 144 GB of Huawei’s own HiZQ 2.0 HBM at 4 TB/s.
What is the Ascend 950’s FP8 performance?
Huawei states 1 PFLOPS in FP8, MXFP8 and HiF8 and 2 PFLOPS in MXFP4 for the Ascend 950 series, with no sparse or dense label.
What is the Atlas 950 SuperPoD?
The Atlas 950 SuperPoD is Huawei’s system of up to 8,192 Ascend 950DT chips, which Huawei said at Huawei Connect 2026 is in large-scale commercial use.
When is the Ascend 950DT available?
Huawei gave its specs at Huawei Connect 2025, with availability in Q4 2026.
Source
Every figure is taken from the vendor’s own datasheet, product page, technical documentation or announcement, linked on each chip with the date it was last checked. How we pick and check sources: editorial standards.